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Die Level Services

Providing the industry with quick turn wire bond packaging as little as just one.  From Prototype to volume IC packaging and IC assembly services.     

The company specializes providing a full turn-key solution that helps get your design to market quickly. We excel in developing a product for a customer  when the quantities are small.  

No need for high cost NRE’s and big lot sizes.

We also specialize in developing conceptual packaging  projects with a low cost of ownership.   

If you have the wafer, or you can get the die, that's all you need for us to start.   

dice it and slice it, its the first step before you PACKAGE it!