Dimation offers a variety of circuit board fabrication to its capabilities. Starting from single to dual sided flex circuits, to  Rigid board and Rigid flex Circuits.   We have built a good reputation for providing Quik-Turn™ assembly and now we are taking it another step farther to provide the same Quik-Turn™ delivery for PCB’s and  Flex circuits.  

 Our  Mission is taken very seriously and when it comes to delivery, we strive for perfection and that is why our customers are coming to us  for even bare board  fabrication.

Because understanding boards really well is part of our life line, we can assist you in all areas of your design.  From a Design on a napkin, to Schematic Capture and then to Board Layout,  we can provide assistance to your engineering team in all levels of service.  Think of us  as being an extension to your internal services by  providing  Engineering support and full layout services prior to ordering your boards.   

By  offering nights and weekend services we get the job done quicker than you can do it internally.   That's our pledge to you.  All you need to do is ask about how we can serve you.  Let us take your multilayer PCB design to reality.

Printed circuit board technologies we fabricate:

Standard FR4 and Hi-Temp FR4, Flex and Rigid-Flex

 DuPont, Rogers, Shin-Etsu

RF/Microwave/High Speed                Hybrids

•   Rogers                                          FR4 with Roger, Arlon,Taconic
•   Taconic                                         FR4 with heavy metal copper
•   Arlon
•   Getek
•   Polyimide

Services: Lead Times

FR4 (1-8 layers): 1 day - 2 weeks turn

FR4 (10-32 layers): 2 days - 3 weeks turn

Flex (1-4 layers): 1 day - 2 weeks turn

Flex (6-20 layers): 5 days - 3 weeks turn

PC Prototype and Small to Medium Sized Runs Fabrication and Assembly

Today's high-tech company demands a variety of PCB capabilities from their suppliers. Dimation offers a range of single layer and multilayer PCB fabrication, including:

 Standard/hi-temp FR4

 Flex/rigid-flex (DuPont, Rogers, Shin-Etsu)

 RF/microwave/high-speed (Rogers, Taconic, Arlon, Getek, Polyimide)

 Hybrids (FR4 with Roger/Arlon/Taconic, FR4 with heavy metal copper)

With a proven commitment to customer service, Dimation sets the standard for PCB fabrication for any company located in the midwest  and beyond--and when businesses need total turn-key services, Dimation also offers printed circuit board and assembly services support.  

Dimation now offers a variety of circuit board fabrication to its capabilities. Starting from single to dual sided flex circuits, to  Rigid board and Rigid flex Circuits.  

We have built a good reputation for providing Quik-Turn™ assembly and now we are taking it another step farther to provide the same Quik-Turn™ delivery for PCB’s and Flex circuits.  

We take  our Mission very seriously and when it comes to delivery, we strive for perfection and that is why our customers are coming to us  for even bare board  fabrication.

At Dimation, we understand boards really well and can assist you in all areas of your design.  

From a Design on a napkin, to Schematic Capture and then to Board Layout,  we can provide assistance to your design team in all levels of service.  Think of us  as being an extension to your internal services by  providing  Engineering / full layout services prior to ordering your boards.   

By  offering nights and weekend services we get the job done quicker than you can do it internally.   That's our pledge to you.  All you need to do is ask about how we can serve you.  

•  Assembly Support -
• Consignment
• Turnkey
•   Computer Modelling and Analysis
•   Layout Services
•   DFM and Reliability
•   Engineering / Application Support
•   Interconnect Solutions
•    Termination Methods
•   Material Selection and Construction

Capabilities

• Panel Size: 18 X 24 max; 12 X 18 min
• Layer Count: 24 max
• Hole Diameter: .004 drilled
• Line Width & Spacing: .002 min
• Dielectric Thickness Mins: .001 Kapton, .002 (FR-4)
• Board Thickness: .125 max
• Soldermask Clearance: .003 min
• 1:1 With LDI Mask for Mask Defined Comps
• UL approved unpierced area: 4"
• Solder Finishes
•  HASL
•  Immersion  Silver, Gold, Tin
•  Electrolytic Gold (Soft Bondable)
•  ENEPIG
•  OSP
•  Laser Drill

(STD Turn Times)

(Includes Expedite Fee’s)

Dimation offers Rigid flex printed circuit boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex layouts are more challenging than the layout of a typical rigid board environment, as these boards are created in a 3D space, which also offers greater spatial efficiency. By being able to layout in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

Process Capabilities

•   Panel Size: 18 X 24 max; 12 X 18 min
•   Layer Count: 30 max
•   Hole Diameter: .004 drilled
•   Line Width & Spacing: .002 min
•   Dielectric Thickness Mins:  
•   .001 Kapton, .002 (FR-4)
•   Board Thickness: .125 max
•   Aspect Ratio: 10:1
•   Soldermask Clearance: .003 min
•   1:1 With LDI Mask for Mask Defined Comps
•   UL approved unpierced area: 4"

Materials Availlable

•   DuPont Pyralux:
•   DuPont AP Copper Clad Laminates
•   DuPont LF and FR
•   Coverlays and Bonding Plys

Hitachi:

• Polyimide laminates
• Polyimide no-flow prepreg

Arlon:

• Laminates and no-flow prepregs

Isola:

• Laminates and no-flow prepregs

(STD Turn Times)

(Includes Expedite Fee’s)

Dimation offers a variety of flex circuit capabilities, including single or double sided circuitry to multilayer technology up to 6 layers. We also have multiple material substrates and adhesives to choose from, along with surface finishes and treatments.

Stiffeners can also be added to reinforce selective areas of the flexible circuitry for component support durability and mounting.

Process Capabilities

 Single or Double Sided Flex: Polyimide,  Polyester

 Multilayer Flex up to 8 layers

 Multilayer Rigid-Flex up to 20+ layers (rigid   area)

 Lines and Spaces: down to 0.003"

 Installation of Connectors, Pins, Contacts, etc.

 MD & PTH Component Assembly available

 Stiffener Supported Areas  (using FR-4,   Polyimide, etc.)

 Blind & Buried Vias

 Controlled Impedance

 Selective Adhesives, PSAs and Thermally   bonded

 EMI / RF Shielding:  Copper, Silver Ink &  Shielding    films

 Circuits up to 24" in length

Flexible Circuit Materials

Substrates

Kapton: Polyimide 1/2 – 5 mils

Mylar: Polyester 2 - 5 mils

Epoxy

Teflon

Copper

Half Hard Electro-deposited

Flex Circuit Adhesives

Modified Acrylic

Modified Epoxy

Pressure Sensitive (PSA)

Solder Mask / Coverlay

Kapton Coverlay 1/2 mil to 5 mils

Polyester Coverlay 1 mil to 3 mils

Photoimageable Coverlay

Soldermask

  Surface Treatment & Finishes

Hard or Soft Gold

Hot Air Level (H.A.L.)

Carbon Printing

Screen Print Solder Mask

Silver

Types of Flex Circuits

Single-Layer Flex Circuit

IPC 6013 - Type 1

One conductive layer, either bonded between two insulating layers or uncovered on one side.

Stiffeners, pins, connectors, components, are optional.

Multi-Layer Flex Circuit

IPC 6013 - Type 3

Three or more flexible conductive layers with flexible insulating layers between each one; outer layers may have covers or exposed pads.

Plated through-holes provide connection between layers.

Controlled impedance possible.

Double-Sided Flex Circuit

IPC 6013, - Type 2

Two conductive layers with an insulating layer between; outer layers may have covers or exposed pads.

Plated through-holes provide connection between layers.

Stiffeners, pins, connectors, components are optional.

Rigid-Flex Circuit

IPC 6013 - Type 4

Two or more conductive layers with either flexible or rigid insulation material as insulators between each one; outer layers may have covers or exposed pads.

Rigid-flex has conductors on the rigid layers, which differentiates it from multi-layer circuits with stiffeners. Plated through-holes extend through both rigid and flexible layers (with the exception of blind and buried vias). Rigid-flex costs more than a standard circuit with stiffeners.

(STD Turn Times)

(Includes Expedite Fee’s)

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AS9100 Service provider

ITAR Registered.