Dimation Inc. ©   2021

AS9100 Service provider

ITAR Registered.  

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when micro packaging support is required, we have the ANSWER.

If wafer level support is required:

We can provide the following services:

• Wafer dicing up to 8”, special configurations and slivers
• Die Inspection and packaging
• Die Attach
• Wire bond ball and wedge
• Encapsulation
• MCM Packaging
• Monolithic Packaging
• Hybrid Packaging
• PoP Package on Package